The original post: /r/hardware by /u/TwelveSilverSwords on 2024-09-28 07:20:18.

https://x.com/QaM_Section31/status/1839851837526290664

The total die area is 169.6 mm². CPU cluster is 48 mm² and GPU cluster is 24 mm². A single Oryon core is 2.55 mm². It’s made on TSMC’s 4nm process node.

SoC Node Die area Core area
Snapdragon X Elite N4P 169.6 mm² Oryon - 2.55 mm²
Apple M4 N3E 165.9 mm² P-core = 2.97 mm²
Apple M3 N3B 146 mm² P-core = 2.49 mm²
Apple M2 N5P 151 mm² P-core = 2.76 mm²
Apple M1 N5 118 mm² P-core = 2.28 mm²
AMD Phoenix N4 178 mm² Zen4 = 3.84 mm²
AMD Strix Point N4P 232 mm² Zen5 = 4.15 mm², Zen5C = 3.09 mm²
Meteor Lake Intel 4 - Redwood Cove = 5.05 mm²

If anybody has more die area/core area figures, please submit them in the comments section below, so I can add them to the above comparison table.

Note: For the Core Area numbers, I have included only private caches. Shared caches have been excluded.