@bOtM to /r/hardware: a technology subreddit for computer hardware news, reviews and discussion. • 4 months agoTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comexternal-linkmessage-square0arrow-up11arrow-down10file-text
arrow-up11arrow-down1external-linkTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.com@bOtM to /r/hardware: a technology subreddit for computer hardware news, reviews and discussion. • 4 months agomessage-square0file-text